晶圓

塑膠膜

保護膜

Glastic PC / 無塵和低折射率的 film

CMOS用玻璃蓋

超高電容

OPC Drum

錫膏

軟版用防焊,文字油墨

石墨粉 / Graphite Powder

 

Solder Paste 焊接用錫膏

*半田合金組成

Sn63 / Pb37

        Sn62/ Pb36/ Ag2

            Sn63/Pb63.5/Ag0.5

          Sn96.5/Ag3/Cu0.5

                Sn96/Ag2.5/Cu0.5/Bil

特長：1.可常溫保存
                                                         2.連續印刷下黏度幾乎不改變,安定性高
                                         3.常溫保存下,也不會產生錫珠

                       全化科技股份有限公司    桃園市經國路857號11樓    TEL:(03)317-5222   Fax：03-3175115
                                                                   上海市浦東新區浦東大道637號1106室    Tel:021-58761199    Fax:021-58760055
                                                                   Block 5022, #03-09, Ang Mo Kio Industrial Park 2, Singapore 569525   Tel: 65-4845498   Fax: 65-4845598